AD712TQ

operational amplifier, CDIP8, ±18V

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Price:: US $3.80~5.50 / piece [Get Latest Price]

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	US $3.80~5.50

PartNumber:: AD712TQ

Brand:: Analog Devices - ADI | Pack: CDIP | D/C: 06+

Availability:: Supply Ability: 10000/Week Can Ship Immediately
Delivery: 10-15 Business Days (ships out within 3 Business days)

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Products Upload time: 2011-07-12

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Part Number:AD712TQ
US $3.80 - 5.50
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Product Summary

The AD712TQ is a high speed, precision monolithic operational amplifier offering high performance at very modest prices. Its very low offset voltage and offset voltage drift are the results of advanced laser wafer trimming technology. These performance benefits allow the user to easily upgrade existing designs that use older precision BiFETs and, in many cases, bipolar op amps. The superior ac and dc performance of the AD712TQ makes it suitable for active filter applications. With a slew rate of 16 V/ms and a settling time of 1 ms to ±0.01%, the AD712TQ is ideal as a buffer for 12-bit D/A and A/D Converters and as a high-speed integrator. The settling time is unmatched by any similar IC amplifier.

Parametrics

AD712TQ absolute maximum ratings: (1)Supply Voltage: ±18 V; (2)Internal Power Dissipation Input Voltage: ±18 V; (3)Output Short Circuit Duration: Indefinite; (4)Differential Input Voltage: +VS and –VS; (5)Storage Temperature Range (Q, H): –65 to +150℃; (6)Storage Temperature Range (N, R): –65 to +125℃; (7)Operating Temperature Range: –55 to +125℃; (8)Lead Temperature Range (Soldering 60 sec): +300℃.

Features

AD712TQ features: (1)Enhanced Replacements for LF412 and TL082; (2)Settles to 60.01% in 1.0 ms; (3)16 V/ms min Slew Rate (AD712J); (4)3 MHz min Unity Gain Bandwidth (AD712J); (5)0.30 mV max Offset Voltage: (AD712C); (6)5 mV/8C max Drift: (AD712C); (7)200 V/mV min Open-Loop Gain (AD712K); (8)4 mV p-p max Noise, 0.1 Hz to 10 Hz (AD712C); (9)Surface Mount Available in Tape and Reel in Accordance; (10)with EIA-481A Standard; (11)Single Version Available: AD711; (12)Quad Version: AD713; (13)Available in Plastic Mini-DIP, Plastic SOIC, Hermetic; (14)Cerdip, Hermetic Metal Can Packages and Chip Form.