AT24C256-10PU-2.7

EEPROM, DIP, -1.0V to +7.0V

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Price:: US $0.40~2.00 / piece [Get Latest Price]

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PartNumber:: AT24C256-10PU-2.7

Brand:: ATMEL Corporation - ATMEL | Pack: DIP | D/C: 07+

Availability:: Supply Ability: 10000/Week Can Ship Immediately
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Products Upload time: 2011-07-05

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Part Number:AT24C256-10PU-2.7
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Product Summary

The AT24C256-10PU-2.7 provides 131,072/262,144 bits of serial electrically erasable and programmable read only memory (EEPROM) organized as 16,384/32,768 words of 8 bits each. Its cascadable feature allows up to 4 devices to share a common Two-wire bus. The AT24C256-10PU-2.7 is optimized for use in many industrial and commercial applications where low power and low voltage operation are essential. It is available in space-saving 8-lead JEDEC PDIP, 8-lead JEDEC SOIC, 8-lead EIAJ SOIC, 8-lead MAP (24C128), 8-lead TSSOP, 8-lead SOIC Array Package and 8-ball dBGA2 packages. In addition, the entire family is available in 2.7V (2.7V to 5.5V) and 1.8V (1.8V to 3.6V) versions.

Parametrics

AT24C256-10PU-2.7 absolute maxing ratings: (1)Operating Temperature: -55℃ to +125 ℃; (2)Storage Temperature: -65℃ to +150℃; (3)Voltage on Any Pin with Respect to Ground: -1.0V to +7.0V; (4)Maximum Operating Voltage: 6.25V; (5)DC Output Current: 5.0 mA.

Features

AT24C256-10PU-2.7 features: (1)Low-voltage and Standard-voltage Operation: 2.7 (VCC = 2.7V to 5.5V); 1.8 (VCC = 1.8V to 3.6V); (2)Internally Organized 16,384 x 8 and 32,768 x 8; (3)Two-wire Serial Interface; (4)Schmitt Trigger, Filtered Inputs for Noise Suppression; (5)Bidirectional Data Transfer Protocol; (6)1 MHz (5V), 400 kHz (2.7V, 2.5V) and 100 kHz (1.8V)Compatibility; (7)Write Protect Pin for Hardware and Software Data Protection; (8)64-byte Page Write Mode (Partial Page Writes Allowed); (9)Self-timed Write Cycle (5 ms Max); (10)High Reliability: Endurance: One Million Write Cycles; Data Retention: 40 Years; (11)Extended Temperature and Lead-free/Halogen-free Devices Available; (12)8-lead JEDEC PDIP, 8-lead JEDEC and EIAJ SOIC, 8-lead MAP, 8-lead TSSOP, 8-lead SAP and 8-ball dBGA2 Packages; (13)Die Sales: Wafer Form, Waffle Pack, and Bumped Wafers.